From: Sean Wise (email@example.com)
Date: Wed Mar 13 2002 - 16:21:44 EET
This is a bit late in coming but I figured better late than never.
My NASUG presentation, Electroforming Applications with Stereolithography
Models, has been posted to the RePliForm web site, www.repliforminc.com. I
apologize for not getting it up sooner but I wanted to draft notes to go
with the slides. It is best viewed with Internet Explorer. The first half
of the presentation covers electroforming used to make prototype and bridge
tooling while the second half covers use of thin metal cladding (.002-.005")
over SL models to improve their stiffness and moisture resistance. If
anyone has an questions about the work presented, please feel free to email
at the address below.
1583 Sulphur Spring Road, Suite 126
Baltimore, MD 21227
Phone 410 242-5110
Fax 530 325-4768
From: firstname.lastname@example.org [mailto:email@example.com]On Behalf
Of Mark Wynn
Sent: Monday, March 04, 2002 10:22 AM
Subject: 3DNASUG update - desired
I realize that most of the attendees are probably just getting
back to work... and will take a half day or more to sort through
their e-mails and other related messages / pressing issues.
But when someone gets a chance, I would love to hear about
any new developments that were shared at the conference!
Thanks in advance
Yazaki North America Inc.
For more information about the rp-ml, see http://rapid.lpt.fi/rp-ml/
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