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From: Elaine Hunt (ehunt@ces.clemson.edu)
Date: Fri Nov 30 2001 - 16:51:21 EET


High resolution 3D microstructures made by localized electrodeposition of
nickel
Jansson, Anders;(Uppsala Univ, Sweden);Thornell, Greger;Johansson, Stefan;
Source: Journal of the Electrochemical Society, v147, 5, 2000, p 1810-1817
Publisher: Electrochemical Soc Inc, Pennington, NJ, USA ISSN: 0013-4651
CODEN: JESOAN In English
Abstract: Techniques to create three-dimensional microstructures are still
a matter of research, and localized electrodeposition is a promising path
to inexpensive free-form microfabrication in metal. The principle is to put
the tip of a needle very close to a conducting substrate submerged in a
plating bath, apply typically 4-5 V, and move the tip as the metal
deposits. In this paper we report improved deposition control and the
benefits of adding ammonia and ammonium formate to nickel plating solutions
for enhanced resolution and surface smoothness. A mirror-smooth 600 Ám tall
nickel column 3 Ám in diameter was built at 4 Ám/s. Still higher axial
deposition rates could be attained, as well as structure diameters down to
2 Ám. The broadening of previously built structures near the one being
grown was studied, and the usefulness of an auxilliary electrode was
confirmed. The possibility of branching and joining structures was also
investigated in order to realize the vision of building structures of
arbitrary shapes.22 Refs.(Author abstract)

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