The primary initial application for this technology would be for ceramic
circuits that are used in cellular phones, multi chip modules, automotive
engine control systems, automobile adaptive speed control (e.g. MB 320), ABS
braking systems, aerospace electronics, and other applications where small
size with high reliability is required.
We expect to be able to achieve the electrical performance of tape cast
ceramic systems with the initial model and outperform (higher density
interconnects) tape cast packaging systems. A ten layer package with
integrated circuits would be approximately 1.25 mm high. Package size can be
from 25 mm x 25 mm to 300 mm x 300 mm. Height will depend upon number of
layers, with each layer approximately 0.08 mm.
For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/
This archive was generated by hypermail 2.1.2 : Tue Jun 05 2001 - 23:02:54 EEST