RE: [rp-ml] Epson - 3D printing

Hi,

I got interested in the same articles you have cited and did a bit of
follow-up digging.

You could try US patent number US2002151171 (Semiconductor device and
manufacturing method therefor, circuit substrate, and electronic apparatus).
I'm not 100% certain it is the same thing as the legal obfuscators have done
a nice job, but the resemblance is striking.

If that's all wrong I'd also be keen to see the right answer.

Cheers,
Jonathan.

-----Original Message-----
From: ben halford [mailto:ben_halford2003@yahoo.co.uk]
Sent: 04 November 2004 13:35
To: rp-ml@rapid.lpt.fi
Subject: [rp-ml] Epson - 3D printing

I don't know if anyone has first hand experience of this process, but I
would be interested in what ink formulation (colloidal suspension) and post
processing steps (burn off) are required to achieve conductivity.

http://www.newscientist.com/news/news.jsp?id=ns99996618

http://www.epson.co.jp/e/newsroom/news_2004_11_01.htm

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