Hello All,
I need some help with the fun topic of SL5180 resin and humidity! Now
before I get any emails on replacing the resin I should tell you my
management has not considered this as an option. What I need to know is:
After the parts are cured how long is it prior to post processing (dry
cleanup, gating)?,
What would you consider to be to much time before the part was processed, in
other words what is the limit of time on a shelf for this stuff?
What methods are you using to remove moisture from the cured pattern (I
already know that moisture cured into the pattern will not come out!),
What is the scope of expansion that you are seeing in your QuickCast
patterns.
My problem is that I am producing several hundred patterns a week and only
have me (not full time on part processing) and one other guy cleaning wet
patterns and getting them into the PCA. And then once they're cured they
may sit on a shelf for up to four weeks prior to being sealed and gated,
again due to the lack of personal. The room that the machines are in is
kept at a constant 72 degrees F and 32% - 37% humidity. The trouble comes
in when they are placed in the post processing room that can be 5% humidity
one day and 60% (has been as high as 98%) the next. After support removal
and a wipe down the patterns are cured for between 6 and 11 hours then
bagged and placed on a shelf back in the machine room where as I said they
may sit for some time prior to gating. The gating takes place in a third
room that is air conditioned to maintain 80 degree temp but humidity is not
controlled.
Any input would be appreciated.
Karl Denton
For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/
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