Wayne:
Sounds like this would be a good part for either the small dia. beam SLA -
or the Actua. If you've ever seen the "business card" sample out of the
Actua, it would leave little doubt that the Actua could do the part.
Attach the file to me Wayne, and I'll build the part for you.
Regards,
Brad Fox
Rapid Design Technologies
At 04:18 PM 3/1/99 -0600, you wrote:
>
>
>I have a potential need for a source that can produce small, highly
>detailed parts to the specifications that follow. The part will be used for
>isolating and mounting IC chips in a test fixture. Dimensions are in
>inches.
>
>The part will have .007 thick fins that are .100 high and .050 wide. They
>may be attached to a solid structure at one end (along the .100) and/or the
>bottom (along the .050). There is a space between fins of .010 which makes
>the pitch .017. This part will fit over (or under) the IC and the fins will
>fit in between the "waterfall" of the leads. There are 60 leads per side
>for a total of 240. The material must be strong, withstand a temperature of
>125 degrees C and must be electrically non-conductive.
>
>I do not have drawings yet. We will consider any process.
>
>I do know of Pure Fluid Magic, but Ms. Iverson, in my last conversation
>with her, indicated that she was not taking on any outside projects.
>
>Thanks in advance for your help.
>
>
>Wayne Foss
>Rockwell Collins, Inc.
>Cedar Rapids, Iowa.
>
>
>
>For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/
>
>
For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/
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