New SL-resin from RPC

From: Steinmann (b.steinmann@rpc.ch)
Date: Mon Nov 09 1998 - 17:35:32 EET


RPC announces a new, fast epoxy resin for stereolithography machines equipped with a He/Cd-laser, RPCure 200 HC.

Parts from RPCure 200 HC have high impact resistance and high elongation to break. In an independant test published at the European Stereolithography User Meeting it was found that small parts from this resin are easily cleaned by isopropanol or TPM. The mechanical tests carried out in this study showed the exceptionally large strain at break of the new RPCure 200 resin. Dimensional accuracy and modulus are largely independant of ambient humidity.

RPCure 200 HC has the following properties:

Dp: 4.88 mils (0.12 mm)
Ec: 8.3 mJ/cm2
Viscosity (30°C): 400-550cps

Properties after UV-cure:
Tensile modulus: 1800 MPa
Tensile strength: 50 MPa
Elongation to break: 17%
Impact resistance, unnotched part (ISO 179): no break
Impact resistance, notched part (ISO 179): 2.2 kJ/m2
Glass transition temperature (DSC): 60°C

For further information, please contact:

Bettina Steinmann
RPC Ltd.
Rapid Prototyping Chemicals
PO Box 259
1723 Marly 1, Switzerland

Phone +41-26-435 69 17
Fax +41-26-435 61 43
e-mail info@rpc.ch

For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/



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