Hi,
-You may try out this web page:
http://www.3dsystems.com/products/products.asp
Thanks & Regards,
<<...>>
LEW KOK FAH
Temasek Polytechnic
Product Engineering
TEL: (65) 780-5490
FAX: (65) 787-4958
kokfah@tp.ac.sg
http://www.tp.ac.sg/
> ----------
> From: bo yang me stnt[SMTP:bxy0487@megahertz.njit.edu]
> Sent: Wednesday, November 04, 1998 11:13 PM
> To: RPML
> Subject: Thermal and mechanical properties of SL 5170 and 5210
>
>
> Hi, Dear RP friends:
>
> Does anyone know the thermal and mechanical properties of the materials of
> SL 5170 and SL 5210. The attributes include the thermal conductivity,
> coeeficient of thermal expansion, the specific heat, the density, the
> Young's modulus and ultimate and yield strength.
>
> If you know these parameters, please let me know or tell me where I can
> get these parameters. Your help is greatly appreciated!
>
> Bo Yang
> Dept. of Mechanical Engineering
> NJIT, Newar, NJ 07032
> Phone:973-642-4577
> fax: 973-596-5601
> http://www.megahertz.edu/~bxy0487
>
>
> For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/
>
For more information about the rp-ml, see http://ltk.hut.fi/rp-ml/
This archive was generated by hypermail 2.1.2 : Tue Jun 05 2001 - 22:47:06 EEST