Martti Huolila wrote:
If you could license the MIT patent (like Zcorp) with the idea of
alternating a non conductive powder and glue and metal powder and
conductive glue you might get a nice niche on the market.
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Why couldn't you make the base material and the primary glue
nonconductive but apply a second conductive glue/ink/material to trace
the circut and you could build more than flat pcb's. The conductive
material spray could be applied in such a way to make the through
contacts between the layers of the circut. To attach the components
you would plate the entire component with the plating only adhearing
to the exposed conductive surfaces. In this way you could manufacture
the printed circut within the case wall of the product instead of as a
seperate component.
Make the conductive material applicator as an add on to the DTM or
Stratisys...and you could build the product in the production material
with the circut as an integral part of the 3D design.
It would work on the Actua and the Cubital as well but the material
selection would be limited. Adding it to an SLA would be much harder,
because the conductive material would need to be applied to the cured
top surface before recoating and the potential for blade contact would
be great.
Sincerely,
Larry Blasch
System Administrator
OPW Fueling Components
P.O. Box 405003
Cincinnati, OH 45240-5003 USA
Voice: (513) 870-3356
Fax: (513) 870-3338
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Disclaimer...The views expressed are personal opinion and not those of
OPW Fueling Components.
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